Intel Foundry Demonstrates Manufacturable AI Chip Test Vehicle

Intel Foundry this week unveiled an 'AI chip test vehicle' demonstrating a manufacturable 8-reticle system-in-package that integrates four 18A logic tiles, 12 HBM4-class stacks, and two I/O tiles. The promotional brief details use of EMIB-T bridges, UCIe die-to-die at 32 GT/s, Foveros vertical stacking, and advanced power delivery like PowerVia to enable multi-chiplet AI/HPC processors. The demo signals Intel's packaging approach for future accelerators, though no working chip was shown.